发明名称 |
SEMICONDUCTOR DEVICE PACKAGE |
摘要 |
A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall; and a lid secured to the metal member. The metal member and the lid enclose substantially the semiconductor device for providing electromagnetic interference shielding.
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申请公布号 |
US2008150095(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20070952480 |
申请日期 |
2007.12.07 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
YANG JUNYOUNG;KIM KIDON;HAN JONGHO;LEE JUNHONG |
分类号 |
H01L23/552 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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