Semiconductor Device and Method of Manufacturing the Same

摘要

Disclosed are a semiconductor device and a method for manufacturing the same, capable of improving the performance of a barrier and inhibiting a discontinuous step coverage and an overhang. The semiconductor device includes an interlayer dielectric layer having a via hole disposed on a semiconductor substrate, a first layer disposed in the via hole and including ruthenium (Ru), a second layer disposed on the first layer and including ruthenium oxide (RuO₂), and a metal line disposed on the second layer and including a copper material.