| 摘要 |
<p>Highly reliable optical chip and optical module. The optical chip (100) is one having a semiconductor laser provided on a first substrate, comprising resonator (18) having beam outgoing face (22) on the superior surface thereof; first electrode (24) and second electrode (26) for driving the semiconductor laser; and multiple pad portions (24a,26a) for flip-chip connection to a second substrate, respectively electrically connected to the first electrode and second electrode. The resonator in a planar view is provided outside the region (25) defined by binding the outermost peripheries of the multiple pad portions with straight lines.</p> |
