| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be manufactured with a reduced manufacturing cost, and also a method of manufacturing the semiconductor device. <P>SOLUTION: Insulating layers 20, 30 and rewiring layers BB, 31 formed to be connected with a pad electrode 11 and to be buried in the insulating layers are formed on a pad electrode 11 formation surface of a semiconductor substrate 10 having the electronic circuit and pad electrodes for connection with the electronic circuit formed thereon, and external connection bumps 40 are formed to be projected from the surface of the insulating layers and to be connected with the rewiring layers. In this case, the rewiring layers and the insulating layers have a flexible resin sheet 30 and a wiring layer 31 (so-called flexible substrate FS) formed on the surface of the sheet in the form of a pattern as their at least parts. <P>COPYRIGHT: (C)2008,JPO&INPIT |
