| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable the state of terminals to be seen easily, and the wetting property of a metal for brazing to be readily verified, when a resin-encapsulated semiconductor device is mounted on a substrate. <P>SOLUTION: The semiconductor device includes a semiconductor element 11, a plurality of electrode pads 12 of the semiconductor element, a plurality of posts 14 connected to the electrode pads, resin 15 encapsulating the height of the posts, and metal bumps for brazing formed at respective tip sections of the posts, where the level difference is provided over the peripheral part of the resin as a whole. <P>COPYRIGHT: (C)2008,JPO&INPIT |
