| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can be handled easily and prevents chippings and exfoliations from occurring easily in resin for covering a substrate. <P>SOLUTION: The semiconductor device 1, having nearly planar appearance, has the substrate 2 having an integrated circuit 3 on a main surface 2a; a rewiring 5, connected to the integrated circuit 3 electrically via a pad electrode 4; an electrode terminal 6 formed on the rewiring 5; and a resin layer 7 for sealing the entire surface of the substrate 2, including the rewiring 5 so that the electrode terminal 6 is exposed outward. At the corner section the rear surface 7b of the resin layer 7 that covers the rear surface 2b of the substrate 2 and a side 7c of the resin layer 7 that covers a side 2c crossing the rear surface 2b of the substrate 2, an inclined plane 7d inclining toward the side 7c from the rear 7b of the resin layer 7 is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
