| 摘要 |
<P>PROBLEM TO BE SOLVED: To effectively perform condensing to a photoelectric conversion part in accordance with minuteness of an element, to secure a light receiving area, and to provide a small and highly sensitive solid-state image pickup element. <P>SOLUTION: Surface width (b) of a photodiode part PD has the same height as a surface of a light shielding film 9 or it is higher than the surface of the light shielding film 9 and a distance between an on-chip lens and the photodiode part becomes remarkably short compared to conventional technology. Thus, incident light can easily be condensed to the photodiode part even if an intra-layer lens is arranged in the photodiode part. A surface area of the photodiode part PD is equal to or larger than an area of an opening part (a) of the light shielding film 9. Even if a pixel size is made small by thinning the pixel, the light receiving area is not restricted by the opening area of the light shielding film 9. Thus, the larger light receiving area can be secured. When a surface (b) of the photodiode part PD has a hemispherical shape projected upward, it may play a role of the lens. Thus, incident light can efficiently be condensed to the photodiode part PD. <P>COPYRIGHT: (C)2008,JPO&INPIT |
