| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in an adhesion property to a glass substrate and an aluminum substrate with high thermal conductivity and high heat-resistance and capable of further attaining enhancement of productivity by direct coating on a heat generation body or a heat release body with it. SOLUTION: If the thermal conductive hot melt adhesive composition with heat-resistance containing an acid anhydride-modified thermoplastic resin and a thermal conductivity giving agent, and having a melt viscosity of 10,000-3,000,000 mPa s at 200°C, a thermal conductivity of 0.4 W/mK or higher, and a peeling off strength relative to the glass substrate or the aluminum substrate of 200 N/m or higher is utilized, enhancement of productivity is attained by direct coating on the heat generation body or the heat release body. COPYRIGHT: (C)2008,JPO&INPIT
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