| 摘要 |
<p>The arrangement (1) has a temperature sensor (3), which is attached on a circuit carrier (4), positioned in an area of a front side (4') of the circuit carrier in proximity to a surface to be measured. An additional circuit carrier (6) and the circuit carrier (4) are connected by two connecting units (5) i.e. metallic springs, where the arrangement is positioned on the surface to be measured such that the circuit carrier (4) with the front side (4') is springily pressed against a surface (2). The front side of the circuit carrier (4) is smoothly implemented and is partially metallized.</p> |
