发明名称 A CLAMPING APPARATUS OF REVET FOR MULTI LAYER CIRCUIT
摘要 A clamping apparatus of riveting for a multi layer printed circuit board is provided to improve productivity by performing a stacking operation on a multi layer printed circuit board by riveting and fixing all layers stacked on the multi layer printed circuit board. A clamping apparatus of riveting for a multi layer circuit board(600) includes a reference riveting supporter member, left and right riveting supporter members(200,300), and setting stand member(400), and a compression plate member(500). The reference riveting supporter member moves forward and backward on a central shaft with respect to a center of a supporter. The compression plate member allows interlayers to be in close contact with each other by compressing the multi layer printed circuit board.
申请公布号 KR20080058312(A) 申请公布日期 2008.06.25
申请号 KR20080052839 申请日期 2008.06.05
申请人 SDA 发明人 KIM, SOUNG HWAN
分类号 H05K13/02;B30B1/00;H05K3/46;H05K13/04 主分类号 H05K13/02
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