| 摘要 |
<p>A semiconductor device and a manufacturing method of the same are provided to make the semiconductor device thin while maintaining the freedom degree for sizes or structures of plural semiconductor chips laminated on a support substrate. A semiconductor device includes a wiring substrate(41), a first semiconductor chip(42), and a second semiconductor chip(44). The first semiconductor chip is mounted over the wiring substrate. The second semiconductor chip is mounted on the first semiconductor chip in such as way that a position of the second semiconductor chip is shifted for that of the first semiconductor chip. A part of a main surface of the second semiconductor chip faces the first semiconductor chip. An electrode pad on the main surface of the second semiconductor chip is connected to a second semiconductor chip coupling pad of the wiring substrate by a coupling unit.</p> |
