Process of fabricating an optoelectronic module and optoelectronic module obtained by this process

摘要

First and third conductive connecting paths are cut through the through opening (53) of a first molding (20) to electrically insulate a first light source circuit from the components of a lead frame accessible outside the first molding. The first light source circuit is connected to the exterior only through a second photoreceptor circuit () to protect the light source circuit from electrostatic discharge. The contact pads of first and second circuits are electrically connected to corresponding uncovered pads of some conductive paths of the lead frame.