| 摘要 |
A conditioner is provided to eliminate slurry remaining on a conditioner body or a disk by spraying a cleaning liquid through a cleaning liquid supply unit, thereby reducing scratches on the wafer surface. A conditioner(120) maintains a surface state of a polishing pad(102) installed in a CMP apparatus. A disk(122) is contacted with a part of the surface of the polishing pad. A disk holder(124) supports the disk. The main body(126) of the conditioner enables the disk and the disk holder to be moved. A cleaning liquid supply unit(128) supplies the cleaning liquid to the disk.
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