ELASTOMER-MODIFIED CHEMICAL MECHANICAL POLISHING PAD

摘要

An elastomer-modified chemical mechanical polishing pad is provided to increase the number of degrees of freedom and to vary pad properties over wide ranges by presenting an elastomeric phase. An elastomer-modified chemical mechanical polishing pad comprises a polymeric matrix with an elastomeric polymer distributed within the polymeric matrix. The polymeric matrix has a glass transition above room temperature. The elastomeric polymer has a glass transition temperature below room temperature and an average length of at least 0.1mum in at least one direction. The elastomeric polymer represents 1 to 45 volume percent of polishing pad and the elastic polymer has a glass transition temperature below room temperature. The polishing pad has an increased diamond conditioner cutting rate in comparison to a polishing pad formed from the polymeric matrix without the elastomeric polymer.