SEMICONDUCTOR STACKED DIE/WAFER CONFIGURATION AND PACKAGING AND METHOD THEREOF
摘要
A reciprocal design symmetry allows stacked wafers or die on wafer to use identical designs or designs that vary only by a few layers (e.g. metal interconnect layers). Flipping or rotating one die or wafer allows the stacked die to have a reciprocal orientation with respect to each other which may be used to decrease the interconnect required between the vertically stacked die and or wafers. Flipping and/or rotating may also be used to improve heat dissipation when wafer and/or die are stacked. The stacked wafers or die may then be packaged.
申请公布号
EP1935006(A2)
申请公布日期
2008.06.25
申请号
EP20060802846
申请日期
2006.08.30
申请人
FREESCALE SEMICONDUCTOR
发明人
POZDER, SCOTT, K.;ALAM, SYED, M.;JONES, ROBERT, E.