发明名称 POLYIMIDE-METAL LAMINATED BODY AND POLYIMIDE CIRCUIT BOARD
摘要 <p>A process for producing a polyimide-metal laminated body includes forming a metal conductive layer on a polyimide film having a ceramic-modified or pseudoceramic-modified surface with a wet plating process which includes forming at least a ground treatment layer by electroless plating, conducting electroless metal plating and conducting electrolytic copper plating.</p>
申请公布号 KR100841414(B1) 申请公布日期 2008.06.25
申请号 KR20067015847 申请日期 2006.08.04
申请人 发明人
分类号 B32B15/08;H05K1/03;H05K3/18;H05K3/38;H05K3/42 主分类号 B32B15/08
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