| 摘要 |
A thin sheet manufacturing method with very high manufacturing efficiency and at a revolutionarily low manufacturing cost per unit area both achieved by expanding the production scale and a thin sheet manufacturing apparatus. A silicon thin sheet (1) is manufactured by the process including a dipping step in which the surface portion of a base sheet (2) is dipped in a silicon melt (10), and silicon is made to adhere to the surface of the base sheet. After the silicon thin sheet (1) formed on the surface (2a) of the base sheet (2) is separated from the base sheet, at least the peripheral portion (4) of the silicon thin sheet (1) is cut. Since a high-quality silicon thin sheet can be manufactured at a high efficiency, the manufacturing cost can be lowered. |
