| 摘要 |
An integrated circuit package system with an offset stacked die is provided to implement straightforward, cost-effective, uncomplicated, accurate, sensitive, effective processes and constructions. An integrated circuit package system with an offset stacked die includes: providing a first integrated circuit die(110); adhering a second integrated circuit die(112) over the first integrated circuit die and offsetting from the first integrated circuit die in one dimension; forming an inter-die layer(102) over the second integrated circuit die; adhering a third integrated circuit die(114) over the inter-die layer and substantially aligning them to the second integrated circuit die; and adhering a fourth integrated circuit die(116) over the third integrated circuit die and offsetting from the third integrated circuit die in the same amount and substantially an opposite direction as the second integrated circuit die to the first integrated circuit die. |
