METHOD FOR SPUTTERING PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a sputtering printed circuit board is provided to reduce a cost and implement various fine patterns without staking copper on a film and an insulator. A method for manufacturing a sputtering printed circuit board includes the step of: supplying a film and an insulator plate(S100); drilling on the film and the insulator plate(S110); forming a primary sputtering thin film layer on drilled top surface and bottom surface(S120); and forming a secondary copper thin film layer on the surface of the primary sputtering thin film layer(S130). The drilled surface is sputtered with copper. The method for manufacturing the sputtering printed circuit board includes a step of: forming a circuit on the surface of the secondary copper thin film layer.