LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

An LED package and a method of manufacturing the same are provided to decrease heat resistance and improve heat property by quickly radiating the heat from the LED to a PCB, MCPCB or a heat insulating board. A mounting hole is formed on a first substrate(100). A penetration hole is formed on a second substrate(200). A metal film is formed at the penetration hole inside. At least one pair of metal layer is formed to be connected electrically with the metal film at the upper side and the lower side of the second substrate. The first substrate is connected on the second substrate. At least one LED(300) which is connected with the metal layer pair is mounted on the mounting hole.