FLIP-CHIP MOUNTING SUBSTRATE

摘要

A flip-chip mounting substrate is provided to eliminate a shape deviation value of a solder bump by forming the solder bumps formed at a junction pad as the same shape mutually. A flip-chip mounting substrate comprises a junction pad, an insulating layer or a solder resist(18), and a wiring pattern. Within the wiring pattern, the junction pad and a specified portion of a lead wire extended from the junction pad continuously are exposed from the solder resist. The exposed part of the wiring pattern is formed as different shapes. Areas of the junction pads are identical to each other practically. And the entire area of the specified portion extended from the junction pad continuously is identical to each other practically.