发明名称 |
METHOD FOR MANUFACTURING ULTRA-THIN CONDUCTIVE DOUBLE-COATED TAPE USING NONWOVEN FABRIC AND THE CONDUCTIVE DOUBLE-COATED TAPE BY THE SAME |
摘要 |
<p>A method for manufacturing an ultra-thin conductive double-coated tape using a non-woven fabric and the conductive double-coated tape by the same are provided to prevent wrong operation or interference resistance by preventing a yarn from being unwoven. A conductive non-woven fabric(1') with a thickness of less than 0.03mm is formed by performing electroless nickel plating, electroless copper chloride plating, and electro-nickel plating on a non-woven fabric(1) with a thickness of less than 0.025mm. A first conductive adhesion layer(2) is formed on an entire surface of one side of the conductive non-woven fabric. A second conductive adhesion layer(3) is formed on an entire surface of the other side of the conductive non-woven fabric. A double-coated tape is formed by attaching detachable release papers(5,5') to the surfaces of the first and second conductive adhesion layers. The conductive double-coated tape with the first and second conductive adhesion layers has a thickness of less than 0.05mm.</p> |
申请公布号 |
KR100841042(B1) |
申请公布日期 |
2008.06.24 |
申请号 |
KR20070072823 |
申请日期 |
2007.07.20 |
申请人 |
MAIN ELECOM CO., LTD.;DONG WON INTECH CO., LTD. |
发明人 |
KIM, YOUNG KIL;PARK, JONG CHAN |
分类号 |
H01B5/14;B32B37/12;C09J7/02 |
主分类号 |
H01B5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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