发明名称 LED PACKAGE AND METHOD OF MANUFACTURING THE SAME
摘要 An LED(light emitting diode) package is provided to make uniform the color distribution of the light having passed through a phosphor layer by uniformly forming a phosphor layer on every surface of a light emitting device from which light is emitted. An electrode(20) is formed on at least one surface of a package body. A light emitting device(40) is mounted on the package body. The light emitting device is surrounded by a phosphor layer(50) with a uniform thickness. The electrode can include an upper electrode formed on the upper surface of the package body and a lower electrode(22) formed on the lower surface of the package body wherein the lower electrode is connected to the upper electrode.
申请公布号 KR20080056925(A) 申请公布日期 2008.06.24
申请号 KR20060130114 申请日期 2006.12.19
申请人 LG ELECTRONICS INC. 发明人 PARK, CHIL KEUN;SONG, KI CHANG
分类号 H01L33/48 主分类号 H01L33/48
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