发明名称 |
LED PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
An LED(light emitting diode) package is provided to make uniform the color distribution of the light having passed through a phosphor layer by uniformly forming a phosphor layer on every surface of a light emitting device from which light is emitted. An electrode(20) is formed on at least one surface of a package body. A light emitting device(40) is mounted on the package body. The light emitting device is surrounded by a phosphor layer(50) with a uniform thickness. The electrode can include an upper electrode formed on the upper surface of the package body and a lower electrode(22) formed on the lower surface of the package body wherein the lower electrode is connected to the upper electrode.
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申请公布号 |
KR20080056925(A) |
申请公布日期 |
2008.06.24 |
申请号 |
KR20060130114 |
申请日期 |
2006.12.19 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
PARK, CHIL KEUN;SONG, KI CHANG |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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