发明名称 |
Derived metric for monitoring die placement |
摘要 |
A method for monitoring die placement includes receiving measurements of an alignment of a semiconductor die mounted in a package by a die packaging tool. The measurements include center offset metrics associated with displacement of a center of the die. A plurality of corner offset metrics is determined based on the center offset metrics and dimensions of the die. A maximum one of the corner offset metrics is selected as a die placement metric. An out of tolerance condition with the die packaging tool is identified based on the die placement metric.
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申请公布号 |
US7390681(B1) |
申请公布日期 |
2008.06.24 |
申请号 |
US20070622635 |
申请日期 |
2007.01.12 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
TRISTAN JOHN E. |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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