| 摘要 |
A method for leveling a substrate in a substrate bonding apparatus is provided to adjust the leveling degree of a substrate automatically, thereby preventing the production loss. In a process, an upper substrate(130) is attached to an upper electrostatic chuck and a lower substrate(131) is attached to a lower electrostatic chuck. An upper chamber part and a lower chamber part are combined. Thereafter, the upper substrate and lower substrate are placed in a closed and vacuum space. The upper substrate and lower substrate are arranged and bonded. A measured value of the gap between the upper and lower substrates is delivered to a control device. Thereafter, the above processes are performed by n times and the correction value of the gap is calculated from the control device. Thereafter, a linear actuator is controlled automatically to adjust the gap to reflect the correction value. |
