| 发明名称 |
Enhanced adhesion strength between mold resin and polyimide |
| 摘要 |
A new method is provided for the interface between a stress relieve interface layer of polyimide and a thereover created layer of mold compound. The invention provides for creating a pattern in the stress relieve layer of polyimide before the layer of mold compound is formed over the stress relieve layer of polyimide.
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| 申请公布号 |
US7390697(B2) |
申请公布日期 |
2008.06.24 |
| 申请号 |
US20050059732 |
申请日期 |
2005.02.17 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHEN KEN;HUANG CHENDER;TSAO PEI-HAW;WANG JONES;HUANG HANK |
| 分类号 |
H01L21/44;H01L21/60;H01L23/31 |
主分类号 |
H01L21/44 |
| 代理机构 |
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