| 摘要 |
An apparatus for processing a molding material of a semiconductor device is provided to remove static electricity and dust remaining on a molding material by injecting ions and air to the molding material. A molded semiconductor device is temporarily placed on a placement member(140). A transfer member(130) reciprocates while the placement member is supported. An injection part(150) injects air to the upper surface of the molding material to remove dust and static electricity. A reciprocation transfer part can be installed to slidingly reciprocate the transfer member horizontally.
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