发明名称 EMI and noise shielding for multi-metal layer high frequency integrated circuit processes
摘要 A circuit element that may generate or be affected by noise or electromagnetic interference may be substantially surrounded by one or more encircling plugs. The encircling plug may be closed by an interconnection layer. The plug may be grounded to reduce the electromagnetic interference or noise generated by or coupled to said passive circuit element.
申请公布号 US7390736(B2) 申请公布日期 2008.06.24
申请号 US20040938768 申请日期 2004.09.10
申请人 INTEL CORPORATION 发明人 PON HARRY Q.
分类号 H01L21/4763;H01L21/02;H01L21/76;H01L21/768;H01L23/522;H01L23/552;H01L23/58;H01L27/12 主分类号 H01L21/4763
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