| 摘要 |
A camera module is provided to reduce its width and height, remove a process of covering and hardening an adhesive, and remove a process of adjusting a focus distance between a lens and an image sensor. An image sensor package(60) comprises an image sensor chip, an FPCB(Flexible Printed Circuit Board) and a transparent board. The FPCB has a print circuit pattern in its side, has a through-hole so that an image recognizing unit of the image sensor chip can be shown, and is connected with the image sensor chip. The transparent board covers the through hole of the FPCB. The print circuit pattern around the trough hole is connected to a pad part formed in an edge of the image sensor chip. A lower end part of a holder(130) is attached to the transparent board of the image sensor package. |
