WAFER CENTERING METHOD EQUIPPED WITH LOCATION SENSOR

摘要

A wafer centering method using location sensors is provided to prevent the measurement from being disturbed by a notch of a wafer and apply the location sensors to wafers having different diameters, since the length of the location sensors are adjustable. A wafer centering method using location sensors comprises the steps of: moving a robot arm forward to locate the robot arm below a wafer(S10); measuring a profile of a wafer using a pair of location sensors installed with different lengths from a list of the robot arm and transferring sensed values to a control unit(S20); locating a finger of the robot arm on a center portion below the wafer by the control unit(S30); and moving the relocated robot arm upward to load the wafer(S40).