| 摘要 |
A laser cutting device is provided to improve the accuracy of cutting processing because a guide member is deformed not to obstruct the displacement of an object. A laser cutting device(10) locally heats and cools an object(7) and forms crack on the object by the heat stress to cut the object. The laser cutting device includes: a holding unit(20) which holds the object; and a processing unit(40) which applies a laser beam(41a) to the object held by the holding unit, to locally heat and cool the object. The holding unit has an air float unit which has an opposite surface facing the object and holds the object in a floating state by ejecting gas toward the object. The object is held in a curved state by making an ejection pressure in the vicinity of a cutting line of the object higher than an ejection pressure at portions other than in the vicinity of the cutting line so as to protrude the cutting line.
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