发明名称 SOLDER ON TIN BASE
摘要 FIELD: chemistry. ^ SUBSTANCE: solder can be used for soldering copper, copper-nickel alloys, and bronze. The solder consists of the following components with the given percentage mass ratios: copper - 3.0-3.5%; nickel - 0.5-1.0%; boron - 0.05-0.1%; antimony - 0.05-0.1%; iron - 0.2-0.4%; tin constitutes the remaining percentage. ^ EFFECT: obtaining of the limit strength of the solder. ^ 1 tbl
申请公布号 RU2326757(C1) 申请公布日期 2008.06.20
申请号 RU20060140490 申请日期 2006.11.15
申请人 SHCHEPOCHKINA JULIJA ALEKSEEVNA 发明人 SHCHEPOCHKINA JULIJA ALEKSEEVNA
分类号 B23K35/26;C22C13/02 主分类号 B23K35/26
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