POLISHING HEAD FOR UNIFORM PRESSURE

摘要

A polishing head of a chemical mechanical polishing apparatus used in a chemical mechanical polishing process is provided to improve flatness of a wafer by pressing wafer surface with uniform pressure to get higher yields. A polishing head(100) of a chemical mechanical polishing apparatus includes a head housing case(110) having a cavity, a head disc(120) attached to the cavity to mount an object to be polished, a pressure transmitting medium(130) filled between the head housing case and the head disc to transmit pressure applied to the head housing case to the head disc and an assembly unit(140) for assembling the head housing case and the head disc together.