| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a frequency adjustment method that facilitates frequency measurement while allowing repeated polishing or repeated polish processing. <P>SOLUTION: The frequency adjustment method for a crystal wafer is composed so that the main face of a crystal wafer subjected to thickness processing and made into small pieces each having a desired outside dimension is polished so as to achieve a desired frequency. The method consists of a step for arraying small crystal pieces on a mask and a step for executing frequency measurement while subjecting the small crystal piece surface to thickness processing by spraying an abrasive onto it. <P>COPYRIGHT: (C)2008,JPO&INPIT |
