| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a member for supporting a semiconductor to which a semiconductor device can be fixed allowing the semiconductor device to be easily peeled after worked and also to provide a method of working a semiconductor device. <P>SOLUTION: The member for supporting the semiconductor is characterized by a sheet deformable under a stress, which is made of glass fiber reinforced plastic having a thermal expansion coefficient of 20 ppm/°C or less at 25 to 125°C; and a member for fixing a semiconductor having a peel strength of 20 N/m or less at the surface which makes contact with a semiconductor device. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
