| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING A SUPPORT STRUCTURE WITH A RECESS |
| 摘要 |
An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; and processing a top edge of the support structure to include a recess for preventing mold bleed.
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| 申请公布号 |
US2008142938(A1) |
申请公布日期 |
2008.06.19 |
| 申请号 |
US20060610401 |
申请日期 |
2006.12.13 |
| 申请人 |
STATS CHIPPAC LTD. |
发明人 |
CHOW SENG GUAN;DIMAANO ANTONIO B. |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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