Metal Particles-Dispersed Composition and Flip Chip Mounting Process and Bump-Forming Process Using the Same

摘要

There is provided a composition that is suitably used for a flip chip mounting process or a bump-forming process. The composition comprises a first component 3 a, a second component 3 b, metal particles 1,1' and a convection additive. The metal particles 1,1' are dispersed in the second component 3 b. The convection additive is contained in the second component 3 b. The first component 3 a is contained in an interior of at least one particle 1 . When such at least one metal particle 1 melts upon heating, the first component 3 a comes in contact with the second component 3 b to form a thermoset resin 3 c. The convection additive is capable of generating a gas upon heating, so that the gas provides a convection effect in the composition.