Semiconductor component comprising a semiconductor chip and method for producing the same

摘要

A semiconductor component ( 1 ) has a semiconductor chip ( 5 ) and a semiconductor component carrier ( 3 ) with external connection strips ( 12, 13, 15 ). The semiconductor chip ( 5 ) has a first electrode ( 6 ) and a control electrode ( 7 ) on its top side ( 8 ) and a second electrode ( 9 ) on its rear side ( 10 ). The semiconductor chip ( 5 ) is fixed by its top side ( 8 ) in flip-chip arrangement ( 11 ) on a first and a second external connection strip ( 12, 13 ) for the first electrode ( 6 ) and the control electrode ( 7 ). The second electrode ( 9 ) is electrically connected to at least one third external connection strip ( 15 ) via a bonding tape ( 14 ).