发明名称 HEAT SINK AND METHOD OF MANUFACTURING THE SAME
摘要 <p>Provided is a heat sink and a method of manufacturing the same. The heat sink manufacturing method includes: a metal ink deposition step (SlO) of depositing metal ink on a ceramic substrate (13) in which the metal ink is mixed with first metal powder having relatively higher thermal conductivity than that of the ceramic substrate (13), to thereby form a metal ink layer (15); a metal ink layer sintering step (S20) of sintering the metal ink layer (15) at a temperature of 5000C to 11000C to thereby combine the first metal powder that has been mixed in the metal ink layer (15) with the ceramic substrate (13), and to thus form a first metal layer (15a) on the upper portion of the ceramic substrate (13); and a second metal layer formation step (S30) of combining second metal having relatively higher thermal conductivity than that of the ceramic substrate (13) on the upper portion of the first metal layer (15a), to thereby form a second metal layer (17) on the upper portion of the first metal layer (15a). Accordingly, ink containing metal having a high thermal conductivity is deposited and sintered on a ceramic substrate and then metal having a high thermal conductivity is plated on the ceramic substrate to manufacture the heat sink, to thereby reduce an inferiority rate at the time of manufacturing the heat sink, prevent deformation from occurring even in a long term use, and have an excellent heat radiating effect.</p>
申请公布号 WO2008072845(A1) 申请公布日期 2008.06.19
申请号 WO2007KR06046 申请日期 2007.11.28
申请人 SEIL ELECTRONICS CO., LTD.;LEE, HI KYOUNG 发明人 LEE, HI KYOUNG
分类号 H01L23/34 主分类号 H01L23/34
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