| 摘要 |
An improved pickup cap (200) is provided with a surface area configuration that imparts a more even temperature distribution across the ball grid array during reflow. The pickup cap, when connected to the electrical connector, may cover the sides of the electrical connector, but not cover the central portion of the electrical connector. Such a configuration of pickup cap surface provides a more even temperature distribution across the grid of solder balls during reflow of solder balls.
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