| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology for coping with finer semiconductor chips and/or circuit boards and enhancing the flexibility in signals, power supplies, and wiring for electrode positions, thereby facilitating the miniaturization of semiconductor chips and the lamination of a plurality of semiconductor chips. <P>SOLUTION: A projection consisting of a metal ball 2 at the tip of a metal fine wire 1 is arranged on an insulating layer 5 on the main surface of a contact semiconductor chip or a base having an electrical connection wiring layer. Further, the metal fine wire 1 is arranged along the insulating layer 5, and the metal fine wire 1 is bonded to an electrode 4 exposed at an opening in the insulating layer 5 in a part other than the metal ball 2 to form external wiring on the main surface of the semiconductor chip or the base. <P>COPYRIGHT: (C)2008,JPO&INPIT |
