| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a practically sufficiently high pad polishing rate while not only restraining elution of metal into slurry, but also preventing detachment of abrasive particles. <P>SOLUTION: In this CMP conditioner, abrasive particles 3 are dispersed and affixed on a conditioning surface 2 of a conditioner body 1 oppositely contacting a polishing pad of a CMP device. A conditioner body 1 comprises a plate 6 having a plate flat surface 6a directed to the conditioning surface 2 and a resin binding phase 4 adhering the abrasive particles 3 on the plate flat surface 6a. The abrasive particles 3 are adhered while ends 3b on a side opposite to a side directed to the conditioning surface 2 are brought into contact wit the plate flat surface 6a. <P>COPYRIGHT: (C)2008,JPO&INPIT |
