| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that the number of wiring layers increases in a previous wiring substrate. <P>SOLUTION: A semiconductor device 1 includes a semiconductor chip 10, a package substrate 20 (wiring substrate), a transmission line 30, and a dummy chip 40 (circuit component). The transmission line 30 is positioned on the upper surface of the package substrate 20. The transmission line 30 transmits a signal sent from the semiconductor chip 10. The dummy chip 40 has a ground plane. A part of the transmission line 30 composes a micro strip line together with the ground plane. <P>COPYRIGHT: (C)2008,JPO&INPIT |
