| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board and method of manufacturing the same, wherein a heat-resistant strength is enhanced, a peeling malfunction of a conductor pattern is suppressed, and reliability is high at a low cost. SOLUTION: In the multilayer circuit board, a plurality of resin films 10a to 10d made of a thermoplastic resin 1 on a surface of which a conductor pattern 2 is formed are attached to each other, so that the conductor pattern 2 is formed in a multilayered state, and the conductor patterns 2 in a different layer are connected to each other between layers by a connection conductor 3 made of a sintered body of a conductive paste. The multilayer circuit board is a multilayer circuit board 100 in which a glass fiber woven material 4 is embedded in the thermoplastic resin 1 of the resin films 10a to 10d constituting an interlayer of the conductor patterns 2. COPYRIGHT: (C)2008,JPO&INPIT |
