| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent debris generated, at the emitting of a laser beam to a cutting-scheduled line, from adhering to the surface of a wafer or bump electrodes, when dividing the wafer into a plurality of individual device pieces, respectively, having bump electrodes by cutting or splitting the wafer. SOLUTION: Each bump 4 is covered by providing an underfill material 9 on the surface (surface of an interlayer insulating film layer 5) of a wafer 1; next, a laser beam L is emitted along a cutting-scheduled line 2, from the surface side of the wafer 1 so as to remove the interlayer insulating film layer 5 and the underfill material 9 on the cutting-scheduled line 2; debris 7 generated at this time are deposited on the underfill material 9, in order to prevent them from adhering to the surface of the wafer 1 or each bump 4. Then, the surface layer of the underfill material 9 is cut, to cut each bump 4 into a uniform height, as well as, making the tip of each bump 4 exposed. COPYRIGHT: (C)2008,JPO&INPIT |
