| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is a three-dimensional mounted device with excellent electric characteristics. SOLUTION: The semiconductor device has a semiconductor chip 1 with an electrode pad 10, a semiconductor chip 2 with an electrode pad 20, an adhesive layer 3 provided between the semiconductor chip 1 and semiconductor chip 2 and fixing the semiconductor chip 1 and semiconductor chip 2 so that the electrode pad 10 and electrode pad 20 face each other, and a plating portion 4 electrically connecting the electrode 10 and electrode 20 to each other. COPYRIGHT: (C)2008,JPO&INPIT
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