| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which ensures good resolution after development, generates no scum because of excellent dispersion stability in a developer, and has good edge fusion resistance and conformability, and a photosensitive resin laminate having a photosensitive resin layer comprising the composition, and to provide a method for forming a resist pattern using the laminate and a method for producing a conductive pattern. <P>SOLUTION: The photosensitive resin composition comprises (a) 20-90 mass% of a binder resin having a carboxyl group content of 100-550 in terms of acid equivalent, comprising 20-80 mass% of benzyl (meth)acrylate as a copolymerized component and 3-60 mass% of 2-ethylhexyl (meth)acrylate as a copolymerized component, and having a weight average molecular weight of 5,000-500,000, (b) 3-70 mass% of a photopolymerizable monomer, and (c) 0.1-20 mass% of a photopolymerization initiator, based on the summation of the photosensitive resin composition. <P>COPYRIGHT: (C)2008,JPO&INPIT |
