| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To test a memory chip accurately only using a test circuit mounted on the memory chip after a system-in package product is assembled, and to improve the design efficiency of the other integrated circuit chip. <P>SOLUTION: A multi-bit memory chip 10 and an integrated circuit chip 20 are electrically connected by bonding wires 22 to assemble a semiconductor device as a SiP product. A test circuit 12 which is required for testing the memory chip after being assembled as the SiP product is mounted to the memory chip only and not mounted to other integrated circuit chip. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
