| 摘要 |
PROBLEM TO BE SOLVED: To enhance the inspection efficiency of a wafer by performing the inspection of an inspection target in consideration of even the efficiency in another process or efficiently performing the inspection of the inspection target and evaluation using the inspection result. SOLUTION: After the wafer is fed out of a pod and the front or back surface having a circuit pattern or the like formed thereon is inspected (steps S1-S6), in the case where the inspection surface of the wafer is the front surface, the wafer is housed in the pod in the state where the front surface turns upward (steps S7 and S8). In the case where the inspection surface of the wafer is back surface, the wafer is housed in the pod in the state where the back surface of the wafer turns upward using the inspection result of the wafer or the wafer is reversed to be housed in the pod in the state that the front surface of the wafer turns upward (steps S7-S11). By this constitution, even in the case where the evaluation of SEM review or the like is performed after inspection, it becomes unnecessary to reverse the wafer fed out of a housing part in the evaluation stage the inspection efficiency of the wafer is achieved. COPYRIGHT: (C)2008,JPO&INPIT
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