| 摘要 |
<p>Glass compositions are provided that are useful in electronic applications, e.g., as reinforcements in printed circuit board substrates. Reduced dielectric constants are provided relative to E-glass, and fiber forming properties are provided that are more commercially practical than D-glass. Glass compositions comprise (in weight%); SiO<SUB>2 </SUB>60-68, Li<SUB>2</SUB>O 0-2, B<SUB>2</SUB>O<SUB>3</SUB> 7-13 Na<SUB>2</SUB>O 0-1, Al<SUB>2</SUB>O<SUB>3</SUB> 9-15 K<SUB>2o</SUB> 0-1, MgO 8-15 Fe<SUB>2</SUB>O<SUB>3</SUB> 0-1, GO 0-4 F<SUB>2</SUB> 0-1, TiO<SUB>2</SUB> 0-2, other constituents 0-5.</p> |
